Lead frame processing device Fusion MTF1
We also offer proposals for handling leads after molding, from the equipment to the mold!
This is a device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them to a transport tray after cutting them into individual pieces. It is equipped with a 3-ton servo press with 2 heads. We design the equipment to meet customer needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting, lead cutting, forming, and more, tailored to the equipment.
- Company：ローム・メカテック
- Price：Other
